System integration 系統整合 (updated: 02/10/2021)

  • Thermal vacuum chamber (TVC) 熱真空艙: was used to test components, payloads, and subsystems on SR-IX (SPSP, ASM, and FOG), SR-X (ASM), FORMOSAT-5 (AIP and FPA/EQM), FORMOSAT-7 (FOG/EQM), IDEASSat (S/C), etc.

  • Payload integration adaptor (PIA) 酬載整合服務: providing payload to access rocket mechanical and electrical (power/signal) interfaces and helping perform environmental tests like temperature cycling test, vibration test, etc.